Projeto conceitual e construção de um protótipo de uma minimáquina para o corte de substratos de Alumina / Conceptual project and construction of a mini dicing prototy to cut Alumina substrate

AUTOR(ES)
DATA DE PUBLICAÇÃO

2009

RESUMO

This work studies the dicing process of ceramic parts and proposes a project strategy to concept and take decisions about configuration for a preliminary project and the construction of a dicing saw or dicing machine prototype. The technology used by modern electronic components is based on narrow and thin ceramic or silicon. One of the techniques to obtain these products is to dice a larger substrate using an abrasive blade to generate low damages and high productivity. The dicing abrasive process uses abrasive blades with thickness around 0,2 mm and peripherycal speeds of 30 m/s. On these conditions, low noise, high precision and high rotation is required, conditions generated by ceramic aerostatic spindles. This work is managed in preliminary project and construction of a dicing saw or dicing machine prototype. This prototype is able to cut substrates with square shape 100 x 100 mm and depth of 5 mm depending on the blade diameter. This work tests cutting conditions as: feed rate, blade wear, blade speed, and also test the die final quality as: chipping, cracking, dicing linearity. Quantity and quality characteristics were both verified by electronic microscopes and perfilometry. Preliminary studies about dicing ceramic parts detected stable production in 5 to 13 mm/s. Lower blade wear in lower rotations and higher cutting forces in higher cutting depth and feed rate.

ASSUNTO(S)

dicing saw dicing machine dicing machine substrate dicing saw máquina de corte substrato

ACESSO AO ARTIGO

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