Electronic Cooling
Mostrando 1-12 de 24 artigos, teses e dissertações.
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1. Aqueous Nanofluids Based on Copper MPA: Synthesis and Characterization
The application and use of efficient cooling fluids have become increasingly important due to the increasing industrial and energy demand associated with the miniaturization of various electronic devices. The search for high-efficiency heat exchanger fluids in the early 1990s led to the development of a new class of refrigerants called nanofluids. The use of
Mat. Res.. Publicado em: 11/01/2018
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2. HOT AEROSOL FIRE EXTINGUISHING AGENTS AND THE ASSOCIATED TECHNOLOGIES: A REVIEW
Abstract Since the phase out of Halon extinguishers in the 1980s, hot aerosol fire suppression technology has gained much attention. Unlike traditional inert gas, foam, water mist and Halon fire suppression agents, hot aerosol fire extinguishing agents do not need to be driven out by pressurized gases and can extinguish class A, B, C, D and K fires at 30 to
Braz. J. Chem. Eng.. Publicado em: 2015-09
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3. Conjugate Cooling of a Discrete Heater in Laminar Channel Flow
Electronic components are usually assembled on printed circuit boards cooled by forced airflow. When the spacing between the boards is small, there is no room to employ a heat sink on critical components. Under these conditions, the components’ thermal control may depend on the conductive path from the heater to the board in addition to the direct convecti
Journal of the Brazilian Society of Mechanical Sciences and Engineering. Publicado em: 2011-09
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4. DIGITAL SIMULATION SYSTEM OF NEUTRON PARAMETERS OF THE TRIGA IPR-R1 NUCLEAR RESEARCH REACTOR / SISTEMA DIGITAL PARA SIMULAÇÃO DOS PARÂMETROS NEUTRÔNICOS DO REATOR NUCLEAR DE PESQUISA TRIGA IPR-1
The IPR-R1 TRIGA Mark I nuclear research reactor, at the Nuclear Technology Development Center (CDTN), is a pool type reactor cooling by light water. TRIGA reactors (Training, Research, Isotope, General Atomics) were designed for research, training and radioisotope production. The International Atomic Energy Agency (IAEA) recommends the use of safety and fri
IBICT - Instituto Brasileiro de Informação em Ciência e Tecnologia. Publicado em: 29/07/2010
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5. Resfriamento de chips eletrônicos através de sistema bifásico utilizando fluído R-134A / Two-phase cooling system for electronic chips based on R-134a fluid
Neste trabalho, é calculado e construído um protótipo de um sistema bifásico fechado para resfriamento de chips eletrônicos baseado em um termosifão. O funcionamento do sistema é baseado na transferência de calor através da ebulição nucleada e da condensação em vasos, o projeto do protótipo é guiado pelos resultados obtidos nos cálculos. O pr
Publicado em: 2010
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6. Análise térmica de um componente eletrônico em um equipamento de telecomunicação / Thermal analysis of electronic component from telecomuni-cation equipment
Determinar o coeficiente de transferência de calor por convecção local sobre um com-ponente eletrônico dentro de um equipamento de telecomunicação em operação não é uma tarefa trivial, pois muitas variáveis do sistema térmico são desconhecidas e difíceis de serem mensuradas. A análise térmica no presente trabalho tem como objetivo estimar as
Publicado em: 2010
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7. Turbulent natural convection in enclosures using large-eddy simulation with localized heating from horizontal bottom surface and cooling from vertical surfaces
Turbulent natural convection of air that happens into inner square cavity with localized heating from horizontal bottom surface has been numerically investigated. Localized heating is simulated by a centrally located heat source on the bottom wall, and two values of the dimensionless heat source length ? are considered in the present work. Solutions are obta
Journal of the Brazilian Society of Mechanical Sciences and Engineering. Publicado em: 2009-09
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8. Catalisadores de Pt suportados, obtidos pelo método solgel : efeito do cério na atividade e estabilidade nas reações de reforma do metano
The effect of Ce as a structural and electronic promoter on the activity and stability of Pt catalysts supported on Al2O3 for methane reforming reactions were investigated to elucidate the metal-support interaction. Pt/Al2O3 and Pt/CeO2-Al2O3 catalysts were prepared by conventional method of wet impregnation on commercial supports and on CeO2- Al2O3 mixed ox
Publicado em: 2009
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9. Analysis of the application potentiality of nodular cast iron ASTM A536 60-40-18 as raw material for thixoforming processes / Estudo da potencialidade da aplicação do ferro fundido nodular ASTM A536 60-40-18 como materia prima para processos de tixoconformação
This work analyses the thixoability, the viability of actual production of thixotropic semi-solid of ferritic nodular cast iron ASTM A536 60-40-18, as well as the phase transformations taking place in the process. Thixoability evaluation is made through thermal analysis by Differential Thermal Analysis (DTA) and Differential Scanning Calorimetry (DSC) tests
Publicado em: 2009
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10. Convective cooling of three discrete heat sources in channel flow
A numerical investigation was performed to evaluate distinct convective heat transfer coefficients for three discrete strip heat sources flush mounted to a wall of a parallel plates channel. Uniform heat flux was considered along each heat source, but the remaining channel surfaces were assumed adiabatic. A laminar airflow with constant properties was forced
Journal of the Brazilian Society of Mechanical Sciences and Engineering. Publicado em: 2008-09
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11. Peltier efect in quasiperiodic structures semiconductors / Efeito Peltier em estruturas semicondutoras quasiperiódicas
There is nowadays a growing demand for located cooling and stabilization in optical and electronic devices, haul of portable systems of cooling that they allow a larger independence in several activities. The modules of thermoelectrical cooling are bombs of heat that use efect Peltier, that consists of the production of a temperature gradient when an electri
Publicado em: 2008
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12. Estimativa de consumo de energia em nivel de instrução para processadores modelados em ArchC / Instruction level power consumption estimation for ArchC processors
The constant reduction in size and consequential increase in number of transistors inside a chip causes an exponential growth in digital circuit power consumption. Combined with the growing demand for portable electronic devices, this has led to a rising concern about energy consumption. The more power is dissipated, the more heat is generated, and the more
Publicado em: 2007